Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538801 | Semiconductor package | Jongho Park, Seung Hwan Kim, Jun Young Oh, Jungjoo Kim, Dong-Ju Jang | 2022-12-27 |
| 11508713 | Methods of manufacturing semiconductor package and package-on-package | Junyoung Oh, Kyonghwan Koh, Sangsoo Kim, Seunghwan KIM, Jongho Park | 2022-11-22 |
| 11469156 | Semiconductor package for discharging heat generated by semiconductor chip | Hyunki Kim, Sangsoo Kim, Seung Hwan Kim, Kyung Suk Oh, Jongho Lee | 2022-10-11 |