Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508713 | Methods of manufacturing semiconductor package and package-on-package | Kyonghwan Koh, Sangsoo Kim, Seunghwan KIM, Jongho Park, Yongkwan Lee | 2022-11-22 |
JO
Junyoung Oh
Overall (2022): #385,972 of 548,613Top 75%
1
Patents 2022