Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482509 | Semiconductor package | Se-Ho You, Kyung Suk Oh | 2022-10-25 |
| 11444060 | Semiconductor package | Sanguk Han, Chajea Jo, Hyoeun Kim | 2022-09-13 |
| 11328966 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Seunghoon Yeon, Sanguk Han | 2022-05-10 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Un-Byoung Kang, Jongho Lee, Young Kun Jee | 2022-01-11 |