Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328966 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Sunkyoung Seo, Sanguk Han | 2022-05-10 |
| 11244894 | Semiconductor packages | Wonil Lee, Yonghoe Cho | 2022-02-08 |