Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488910 | Semiconductor package having redistribution layer | Il Hwan Kim, Un-Byoung Kang | 2022-11-01 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Hae-Jung Yu, Sangwon Kim, Un-Byoung Kang, Jongho Lee, Dae-Woo Kim +1 more | 2022-03-22 |
| 11227855 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Ji Hwang Kim, Jong Bo Shim | 2022-01-18 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee | 2022-01-11 |