Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Hyunkyu Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2022-06-21 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Yungcheol Kong, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |
| 11227855 | Semiconductor package | Jang-woo Lee, Un-Byoung Kang, Jong Bo Shim, Young Kun Jee | 2022-01-18 |