Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527470 | Film package and method of fabricating package module | Shle-Ge Lee, Ji-Yong Park | 2022-12-13 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Ji Hwang Kim, Yungcheol Kong, Taehwan Kim +1 more | 2022-06-21 |