Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482554 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Hyunsu Jun, Kyoungsei Choi | 2022-10-25 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Jongbo Shim, Ji Hwang Kim, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |