Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482554 | Semiconductor package and method of fabricating the same | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2022-10-25 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jihwang Kim, Jeongmin Kang, Hyunkyu Kim, Jongbo Shim | 2022-08-02 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Eunhee Jung | 2022-06-21 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jongbo Shim | 2022-06-21 |