Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404382 | Semiconductor package including an embedded semiconductor device | Jihwang Kim, Jeongmin Kang, Jongbo Shim, Kyoungsei Choi | 2022-08-02 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2022-06-21 |