Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi | 2022-06-21 |
EJ
Eunhee Jung
Overall (2022): #460,207 of 548,613Top 85%
1
Patents 2022