Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521934 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jongbo Shim, Choongbin Yim | 2022-12-06 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jeongmin Kang, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi | 2022-08-02 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi | 2022-06-21 |