CL

Chung-Sun Lee

Samsung: 1 patents #7,077 of 17,243Top 45%
📍 Anyang-si, KR: #131 of 365 inventorsTop 40%
Overall (2022): #498,199 of 548,613Top 95%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11315802 Method for manufacturing semiconductor package having redistribution layer Il Hwan Kim, Un-Byoung Kang 2022-04-26