Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488860 | Integrated circuit device and method of manufacturing the same | Su-Jeong Park, Dong-Chan Lim, Kwang-Jin Moon, Ju Bin SEO, Atsushi Fujisaki | 2022-11-01 |
| 11444014 | Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same | Jinho Chun, Jin Ho An, Teahwa Jeong, Jeonggi Jin, Atsushi Fujisaki | 2022-09-13 |
| 11302660 | Semiconductor devices and semiconductor packages including the same | Un-Byoung Kang, Jin Ho An, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2022-04-12 |