Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444014 | Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same | Jinho Chun, Jin Ho An, Jeonggi Jin, Ju-Il Choi, Atsushi Fujisaki | 2022-09-13 |