Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-10-18 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-07-26 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia +1 more | 2022-07-12 |
| 11367643 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-06-21 |
| 11362307 | Encapsulation having polymer and dielectric layers for electronic displays | Byung Sung Kwak, Robert Jan Visser | 2022-06-14 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Prayudi Lianto, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11329003 | Anchoring dies using 3D printing to form reconstructed wafer | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-10 |
| 11322381 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-03 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more | 2022-03-22 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-03-01 |
| 11264331 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-03-01 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Jeffrey L. Franklin +1 more | 2022-02-22 |
| 11258045 | Methods of forming stretchable encapsulation for electronic displays | Byung Sung Kwak, Robert Jan Visser | 2022-02-22 |