Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Wolfgang Hetzel, Stefan Macheiner | 2022-10-11 |
| 11302613 | Double-sided cooled molded semiconductor package | Chau Fatt Chiang, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2022-04-12 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Chee Yang Ng, Klaus Schiess | 2022-03-29 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye +4 more | 2022-03-15 |