Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302613 | Double-sided cooled molded semiconductor package | Swee Kah Lee, Josef Maerz, Thomas Stoek, Chee Voon Tan | 2022-04-12 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |