Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng, Klaus Schiess | 2022-03-29 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |