Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Wolfgang Hetzel, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Hoe Jian Chong, Cher Hau Danny Koh, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |