Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11502042 | Processing of one or more carrier bodies and electronic components by multiple alignment | Thorsten Meyer, Thomas Behrens, Martin Gruber, Peter Strobel | 2022-11-15 |
| 11469161 | Lead frame-based semiconductor package | Chan Lam Cha, Wolfgang Hetzel, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Ralf Wombacher | 2022-04-19 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thorsten Meyer, Thomas Behrens, Andreas Grassmann, Martin Gruber | 2022-03-01 |