Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2022-12-27 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Michael Juerss, Josef Maerz +3 more | 2022-11-29 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Ralf Otremba, Fabian Schnoy | 2022-04-12 |