Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Josef Maerz +3 more | 2022-11-29 |