Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss +3 more | 2022-11-29 |
| 11393743 | Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation | Stuart Cardwell, Chee Yang Ng, Clive O'Dell, Mark Pavier | 2022-07-19 |
| 11302613 | Double-sided cooled molded semiconductor package | Chau Fatt Chiang, Swee Kah Lee, Thomas Stoek, Chee Voon Tan | 2022-04-12 |