Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521907 | Hybrid embedded package | Stefan Woetzel | 2022-12-06 |
| 11393743 | Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation | Stuart Cardwell, Josef Maerz, Clive O'Dell, Mark Pavier | 2022-07-19 |
| 11289436 | Semiconductor package having a laser-activatable mold compound | Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Klaus Schiess | 2022-03-29 |