Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532541 | Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die | Petteri Palm | 2022-12-20 |
| 11502012 | Semiconductor packages and methods of manufacturing thereof | Tomasz Naeve, Petteri Palm | 2022-11-15 |
| 11469164 | Space efficient and low parasitic half bridge | Robert Fehler, Danny Clavette, Petteri Palm | 2022-10-11 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 11258162 | Antenna package and method of formation thereof | Ashutosh Baheti, Saverio Trotta | 2022-02-22 |