Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539291 | Method of manufacturing a power semiconductor system | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2022-12-27 |
| 11532541 | Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die | Eung San Cho | 2022-12-20 |
| 11502012 | Semiconductor packages and methods of manufacturing thereof | Eung San Cho, Tomasz Naeve | 2022-11-15 |
| 11469164 | Space efficient and low parasitic half bridge | Robert Fehler, Eung San Cho, Danny Clavette | 2022-10-11 |
| 11444017 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2022-09-13 |
| 11430669 | Forming a lock structure in a semiconductor chip pad | — | 2022-08-30 |
| 11373944 | Die package and method of forming a die package | — | 2022-06-28 |
| 11348861 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2022-05-31 |
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Thorsten Scharf, Ralf Wombacher | 2022-04-19 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 11303222 | Multiphase inverter apparatus | Tomasz Naeve, Elvir Kahrimanovic | 2022-04-12 |