Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2022-04-19 |
RW
Ralf Wombacher
Overall (2022): #290,991 of 548,613Top 55%
1
Patents 2022