Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342252 | Leadframe leads having fully plated end faces | Stefan Macheiner | 2022-05-24 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Petteri Palm, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |