Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Wolfgang Hetzel, Swee Kah Lee | 2022-10-11 |
| 11342252 | Leadframe leads having fully plated end faces | Markus Dinkel | 2022-05-24 |