Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Chan Lam Cha, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
WH
Wolfgang Hetzel
Overall (2022): #210,010 of 548,613Top 40%
1
Patents 2022