Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450642 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2022-09-20 |
| 11424217 | Soldering a conductor to an aluminum layer | Alexander Heinrich, Stefan Schwab | 2022-08-23 |
| 11355424 | Multi-chip package | Teck Sim Lee, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2022-06-07 |
| 11329000 | Package for a multi-chip power semiconductor device | — | 2022-05-10 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Fabian Schnoy | 2022-04-12 |
| 11217510 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2022-01-04 |