Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362023 | Package lead design with grooves for improved dambar separation | Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan +2 more | 2022-06-14 |
| 11355424 | Multi-chip package | Ralf Otremba, Teck Sim Lee, Mohd Hasrul Zulkifli | 2022-06-07 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Thai Kee Gan, Edward Fuergut, Teck Sim Lee | 2022-05-31 |