Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355424 | Multi-chip package | Ralf Otremba, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2022-06-07 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Thai Kee Gan, Edward Fuergut, Lee Shuang Wang | 2022-05-31 |