Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417538 | Semiconductor package including leads of different lengths | Edmund Sales Cabatbat | 2022-08-16 |
| 11348866 | Package and lead frame design for enhanced creepage and clearance | Edward Fuergut, Teck Sim Lee, Lee Shuang Wang | 2022-05-31 |