Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450642 | Soldering a conductor to an aluminum metallization | Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss | 2022-09-20 |
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Wolfgang Lehnert, Norbert Mais, Verena Muhr, Harry Sax | 2022-05-10 |