WL

Wolfgang Lehnert

Infineon Technologies Ag: 3 patents #82 of 862Top 10%
📍 Lintach, DE: #1 of 1 inventorsTop 100%
Overall (2022): #57,041 of 548,613Top 15%
3
Patents 2022

Issued Patents 2022

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11424201 Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device Michael Rogalli, Johann Gatterbauer, Kurt Matoy, Evelyn Napetschnig, Manfred Schneegans +1 more 2022-08-23
11373863 Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate Roland Rupp, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Matteo Piccin 2022-06-28
11328935 Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package Johann Gatterbauer, Norbert Mais, Verena Muhr, Edmund Riedl, Harry Sax 2022-05-10