Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515264 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Francisco Javier Santos Rodriguez, Alexander Breymesser, Erich Griebl, Michael Knabl, Matthias Kuenle +4 more | 2022-11-29 |
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-10-18 |
| 11417528 | Method of manufacturing a semiconductor device and semiconductor wafer | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-08-16 |
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski, Francisco Javier Santos Rodriguez, Ronny Kern | 2022-07-19 |
| 11373863 | Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate | Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Wolfgang Lehnert, Matteo Piccin | 2022-06-28 |
| 11367683 | Silicon carbide device and method for forming a silicon carbide device | Edward Fuergut, Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Martin Gruber +3 more | 2022-06-21 |
| 11251269 | Semiconductor device including trench gate structure and manufacturing method | Reinhard Ploss, Thomas Aichinger, Hans-Joachim Schulze | 2022-02-15 |
| 11239384 | Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-02-01 |