Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515264 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Francisco Javier Santos Rodriguez, Erich Griebl, Michael Knabl, Matthias Kuenle, Andreas Moser +4 more | 2022-11-29 |
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Roland Rupp, Andre Brockmeier, Carsten von Koblinski, Francisco Javier Santos Rodriguez, Ronny Kern | 2022-07-19 |