Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Roland Rupp, Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski, Francisco Javier Santos Rodriguez | 2022-07-19 |