Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527468 | Semiconductor oxide or glass based connection body with wiring structure | Andreas Riegler, Christian Fachmann, Matteo-Alessandro Kutschak, Hans Weber | 2022-12-13 |
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Roland Rupp, Alexander Breymesser, Andre Brockmeier, Francisco Javier Santos Rodriguez, Ronny Kern | 2022-07-19 |
| 11342433 | Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices | Ralf Siemieniec, Thomas Aichinger, Iris Moder, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-05-24 |
| 11322400 | Roughening of a metallization layer on a semiconductor wafer | Tobias Polster | 2022-05-03 |
| 11302579 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl +1 more | 2022-04-12 |