Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322400 | Roughening of a metallization layer on a semiconductor wafer | Carsten von Koblinski | 2022-05-03 |
| 11302579 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2022-04-12 |