Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515264 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Alexander Breymesser, Erich Griebl, Michael Knabl, Matthias Kuenle, Andreas Moser +4 more | 2022-11-29 |
| 11502190 | Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor device | Andre Brockmeier, Hans-Joachim Schulze | 2022-11-15 |
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Hans-Joachim Schulze | 2022-10-18 |
| 11417528 | Method of manufacturing a semiconductor device and semiconductor wafer | Roland Rupp, Hans-Joachim Schulze | 2022-08-16 |
| 11393784 | Semiconductor package devices and method for forming semiconductor package devices | Roland Rupp, Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski, Ronny Kern | 2022-07-19 |
| 11342433 | Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices | Ralf Siemieniec, Thomas Aichinger, Iris Moder, Hans-Joachim Schulze, Carsten von Koblinski | 2022-05-24 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Fabian Craes, Barbara Eichinger, Martin Mischitz, Frederik Otto, Fabien Thion | 2022-05-10 |
| 11251266 | Power semiconductor device and method of processing a power semiconductor device | Philip Christoph Brandt, Manfred Pfaffenlehner, Frank Pfirsch, Steffen Schmidt, Frank Umbach | 2022-02-15 |
| 11239384 | Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing | Roland Rupp, Hans-Joachim Schulze | 2022-02-01 |