Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Ali Roshanghias, Alfred Binder, Barbara Eichinger, Stefan Karner, Rainer Pelzer | 2022-11-01 |
| 11329021 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Francisco Javier Santos Rodriguez, Fabian Craes, Barbara Eichinger, Frederik Otto, Fabien Thion | 2022-05-10 |