Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Ali Roshanghias, Alfred Binder, Barbara Eichinger, Stefan Karner, Martin Mischitz | 2022-11-01 |
| 11276624 | Semiconductor device power metallization layer with stress-relieving heat sink structure | Michael Nelhiebel, Heiko Assmann, Olaf Heitzsch, Jakob Kriz, Sven Lanzerstorfer +3 more | 2022-03-15 |
| 11239188 | Terminal structure of a power semiconductor device | Markus Zundel, Manfred Schneegans | 2022-02-01 |