Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276624 | Semiconductor device power metallization layer with stress-relieving heat sink structure | Michael Nelhiebel, Heiko Assmann, Olaf Heitzsch, Sven Lanzerstorfer, Rainer Pelzer +3 more | 2022-03-15 |