Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488921 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Alfred Binder, Barbara Eichinger, Stefan Karner, Martin Mischitz, Rainer Pelzer | 2022-11-01 |