Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-10-18 |
| 11404262 | Method for partially removing a semiconductor wafer | Sophia Friedler, Iris Moder, Ingo Muri | 2022-08-02 |
| 11373857 | Semiconductor surface smoothing and semiconductor arrangement | Iris Moder, Petra Fischer | 2022-06-28 |
| 11328955 | Semiconductor chip including back-side conductive layer | Ingo Muri | 2022-05-10 |