Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328935 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Johann Gatterbauer, Wolfgang Lehnert, Norbert Mais, Verena Muhr, Edmund Riedl | 2022-05-10 |