Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Chan Lam Cha, Hoe Jian Chong, Cher Hau Danny Koh, Mei Yong Wang | 2022-01-04 |